Whether it’s high-voltage batteries, power electronics or humanoid robotics – when developing modern technologies, compact installation spaces, weight targets, thermal management and cost-effective manufacturing processes need to be considered simultaneously. With WEVOSIL 26029 FL, WEVO-CHEMIE GmbH presents a new silicone gap filler specially designed to meet these demands. The material combines a thermal conductivity of 3 W/m·K with rheological properties optimised for processing and a comparatively low density of 2.22 g/cm³.
Conventional paste-like gap fillers with high viscosity quickly reach their limits when filling gaps measuring just a few millimetres. WEVOSIL 26029 FL, on the other hand, can be reliably applied, even in tight spaces.
Processing characteristics for efficient series production
With its precisely tailored rheological properties, Wevo’s new silicone gap filler can be applied as a bead and compressed into place using low pressure. If no free areas need to be connected, gaps can also be filled by injection – the product then remains in the gap without flowing out, owing to its high sag resistance.
The silicone gap filler can be processed using standard dosing systems, such as those used for potting applications – with both piston and eccentric screw pumps. Extruders or barrel as well as drum extrusion stations, which are required for many highly-filled gap fillers, are not necessary.
The sedimentation-optimised formulation of WEVOSIL 26029 FL allows it to be stirred using simple mixing tools within a few minutes, even after prolonged storage. The choice of filler and the low viscosity also help to prevent abrasion in the dosing systems and the associated maintenance costs.
Material properties for weight-optimised assemblies
Following curing without any by-products or volume shrinkage, the silicone gap filler provides tackiness (long-lasting surface stickiness) and good mechanical properties. As a thermal interface material (TIM), WEVOSIL 26029 FL combines a thermal conductivity of 3 W/m·K with a density of just 2.22 g/cm³. Featuring a significantly lower density than many highly-filled gap fillers with comparable thermal conductivity, the new Wevo product also supports weight-optimised assembly designs.
Gap filler for batteries and humanoid robots
In addition to high-voltage batteries – such as those for electric vehicles or industrial environments – robotics is one of the potential areas of application for this material. In humanoid robots, for example, compact high-performance batteries or electronic components can be thermally bonded to the outer skin using the silicone gap filler, even in narrow areas with thin layers of 1 to 2 mm, to support rapid, uniform heat dissipation.
- Thermal conductivity and low density: The silicone gap filler WEVOSIL 26029 FL combines a thermal conductivity of 3 W/m·K with a density of 2.22 g/cm³, supporting efficient thermal management and the weight-optimised design of compact assemblies.
- Process-optimised handling: WEVOSIL 26029 FL enables reliable filling of narrow gap geometries by bead application or injection. Its high sag resistance ensures that the material remains in the gap after application without flowing out.
- Use in high-performance applications: The RTV silicone is suitable for applications including high-voltage batteries, power electronics and humanoid robotics. It enables the thermal bonding of compact high-performance batteries or electronic components, even at layer thicknesses of 1 to 2 mm.
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